| Time | Topics | Abstract |
|---|---|---|
| 13:00~13:10 | Welcome Remarks | |
| 13:10~13:40 | Deployment of 5G RF FEM (Front-End-Module) within Interoperable Simulation Platform | |
| 13:40~14:20 | Pioneering the future of Sub-THz communications: Cutting-edge measurement solution for PA and Dual-Band MIMO system | Sub-terahertz (Sub-THz) technology is gaining attention as a promising solution to meet the growing demand for wide-bandwidth data communications in next-generation communication networks. However, there are several challenges to its implementation, including effective evaluation of components and systems, and measurement accuracy. This presentation will focus on advanced measurement techniques utilizing VNA, VSG, VSA, arbitrary waveform generators, and digitizers for wide-bandwidth modulated signal generation and evaluation, that contribute to the practical application of Sub-THz technology. Presentation will cover two main measurements: • VCA solution for D-band PA measurement, including DPD. • Dual-Band MIMO measurement test-bed achieving 127Gbps. |
| 14:20~15:00 | The Importance of Accurate Raw Materials Measurement and Correct Methodology Use | In today's rapidly growing industries of commercial comms, like 5G and beyond, military communications and autonomous vehicles, there is an increased demand for the highest level of raw materials performance. Fundamental to ensure the highest quality performance is the quality of materials used in the development and deployment of these systems. In 5G and 6G wireless or even wired communication solutions, the key trend is to be able to move to higher density data communication systems that have very low, sub 1ms latencies. To achieve this, it means that designers of these systems must go higher in frequency to accommodate wider bandwidths. At the mmWave frequency range, the propagation properties of the materials being used start to play a very critical role in the overall performance. Materials property is a last place to think that is the cause or limitation of the performance. However, the fact is everything starts with raw materials. Without knowing the reliable material measurement solutions commercially available today, manufacturers are forced to extrapolate materials data from low frequencies to high frequencies, which can lead to mistakes that can have potentially devastating costs. This presentation will explain why choosing correct method will help shorten product design cycle, share best practices for measurement and test methodology. |
| 15:00~15:20 | Break & Booth Tour | |
| 15:20~16:00 | Characterization of WBG Power Modules, Device Modeling, and Circuit Simulation | |
| 16:00~16:30 | The High-Speed 224Gb/s PAM4 Interconnection Solution | The High-Speed 224Gb/s PAM4 interconnection solution - 224Gb SI-Fly HD connector & Eye Speed® ultra-low skew twinax cable for high-speed application - Precision RF BE70A/BE90A solution for 224Gb/s test application |
| 16:30~17:00 | 5G and 6G On-wafer Measurements Advancements | |
| 17:00~17:30 | Advancing 5G/6G: Innovative Approaches in Wafer-Level mmW Calibration and Characterization | As the telecommunications industry swiftly moves towards 5G and 6G technologies, the need for precise and advanced on-wafer testing methodologies has never been more crucial. This presentation by MPI Corporation's Advanced Semiconductor Test Division explores groundbreaking approaches in instrumentation integration, RF probe calibration and high-frequency measurements, tailored for 5G/6G components. Our team, delves into the challenges and solutions in maintaining accuracy and reliability in high-frequency on-wafer testing, especially under varying temperature conditions. We will showcase our latest innovations and techniques, that will help you to positioning your products at the forefront of semiconductor technology in the age of 5G and 6G. |
| 17:30~17:40 | Wrap-up & Lucky Draw |
